Directional heat rectification in electronic logic circuits via near-field radiative heat transfer

Abstract

As electronic devices become increasingly compact and integrated, conventional heat dissipation techniques are proving insufficient, posing challenges to device longevity and performance. In this review, the state-of-the-art approach to nanoscale temperature management, near-field radiative heat transfer (NFRHT), is examined to explore the emerging concept of heat rectification in electronic logic circuits. Despite growing interest in NFRHT, most studies have primarily focused on geometric refinement and heat flux amplification, with limited attention to its functional integration within logic circuits. This review synthesizes recent advancements in leveraging NFRHT for directional control of heat flow, providing a comprehensive perspective on strategies for transforming nanoscale heat regulation. NFRHT performance can be significantly enhanced through strategic material selection, structural asymmetry, and nanoscale gap control, enabling its integration into advanced logic components such as phononic gates, rectifiers, switches, and thermotronic diodes. Representative studies report rectification efficiencies of up to 93% using materials such as Bi₂Se₃, vanadium dioxide (VO₂), gold, and doped silicon in sub-100-nm gaps. With its capacity to regulate heat currents, NFRHT offers promising avenues for mitigating localized overheating and improving the energy efficiency of logic devices. The review concludes by highlighting how NFRHT-driven heat rectification can address challenges related to materials variability and gap control while proposing future research directions for advanced carbon-based thermo-logic devices.